CM-T335: TI AM335x
Miniature Size and Power Efficiency
OPTIMIZED FOR INDUSTRIAL EMBEDDED APPLICATIONS
Ideal Solution for Cost-sensitive Systems
AM335x SoC manufactured by Texas Instruments provides up to 600 MHz Sitara™ ARM® Cortex™-A8 32-bit RISC CPU.
CM-T335 is available with up to 512MB of DDR3. The DDR3 interface is 16-bits wide and operates at up to 303 MHz clock frequencies.

Top Features

System Core and Graphics
CPU | Texas Instruments AM3352 CPU, 300MHz 32KB (L1) + 256KB (L2) cache |
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Texas Instruments AM3354 CPU, 600MHz 32KB (L1) + 256KB (L2) cache |
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Graphics Acceleration Unit |
PowerVR SGX530 GPU providing 2D / 3D graphics acceleration with OpenGL-ES and OpenVG support. | |
RAM | 128MB – 512MB, DDR3-1066, 16-bit bus width | |
Storage | On-board NAND flash disk, 128MB – 1GB, 8bit, SLC |
I/O
USB | USB2.0 OTG high-speed port, 480 Mbps |
4x USB2.0 host high-speed ports, 480 Mbps (precludes OTG mode) | |
Serial Ports (UARTs) |
Up to 5 UART ports, TIA/EIA-232-F compatible, 3.3V interface, up to 5.0 Mbps |
CAN bus | Up to 2 CAN bus interfaces, 3.3V levels |
MMC/SD/ SDIO |
Up to 2 MMC/SD/SDIO interfaces, support for HC MMC and SDHC up to 32GB |
SPI | Up to 2 configurable SPI bus interfaces (Slave/Master modes) |
I2C | Up to 2 I2C interfaces (up to 400Kbps) |
GPIO | Up to 70 multifunction signals. Can be used as GPIO (shared with other functions) |
ADC | Up to 8 general-purpose ADC channels |


Environmental and Reliability
MTTF | > 200,000 hours | |
Operation temperature (case) | Commercial: 0° to 70° C Extended: -20° to 70° C Industrial: -40° to 85° C |
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Storage temperature | -40° to 85° C | |
Relative humidity | 10% to 90% (operation) 05% to 95% (storage) |
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Shock | 50G / 20 ms | |
Vibration | 20G / 0 – 600 Hz |