MCM-iMX8M-Plus: SMD solder-down

Ultra Miniature Form-factor - 30 x 30 mm, 5 gram

HIGH PERFORMANCE GRAPHICS AND IMAGE PROCESSING

Ideal for Space Constrained and Portable Systems

The NXP i.MX8M Plus processor family of processors features advanced implementation of a quad ARM® Cortex®-A53 core, which operates at speeds of up to 1.8 GHz. A general purpose ARM Cortex-M7, 800Mhz core processor is for low-power processing.

Top Features

NXP i.MX8M Mini ARM Cortex-A53 MPCore

CPU Core

PUNXP i.MX8M Plus Quad, quad-core ARM Cortex-A53, 1.8GHz
NXP i.MX8M Plus Quad, quad-core ARM Cortex-A53, 1.6GHz, industrial temp. grade
NXP i.MX8M Plus QuadLite, quad-core ARM Cortex-A53, 1.8GHz
Video Decode1080p60 HEVC/H.265, AVC/H.264, VP9, VP8
Video Encode1080p60 HEVC/H.265, AVC/H.264
GPUGC7000UL GPU
OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1
NPUAI/ML Neural Processing Unit, up to 2.3 TOPS
DSPTensilica® HiFi 4 DSP
Real-Time
Co-processor
ARM Cortex-M7, 800Mhz

I/O

PCI ExpressPCIe x1 Gen. 3.0
USB2x USB3.0 dual-role ports
UARTUp to 4x UART
CAN busUp-to 2x CAN
SD/SDIOUp to 2x SD/SDIO
SPIUp to 2x SPI
I2CUp to 5x I2C
PWMUp to 4x general purpose PWM signals
GPIOUp to 115x GPIO (multifunctional signals shared with other functions)

Environmental and Reliability

MTTF> 200,000 hours
Operation temperature (case)Commercial: 0° to 70° C
Extended: -20° to 70° C
Industrial: -40° to 85° C
Storage temperature-40° to 85° C
Relative humidity10% to 90% (operation)
05% to 95% (storage)
Shock50G / 20 ms
Vibration20G / 0 – 600 Hz

Feature Highlights

  • Up to 8GB LPDDR4 and 64GB eMMC
  • HDMI, LVDS, MIPI-DSI, 2x MIPI-CSI
  • PCIe, 2x RGMII, 2x USB3.0, 2x CAN, 4x UART, 115x GPIO
  • Wide temperature range of -40C to 85C

Solderable QFN Package

  • Quad-core ARM Cortex-A53 CPU, 1.8GHz
  • 2D/3D GPU, 1080p VPU and AI/ML Processing Unit
  • Solderable as a regular QFN component
  • Designed for SMT placement and reflow soldering
  • Tiny size and weight – 30 x 30 x 3 mm, 5 gram