Tensor-I22
IIOT (Industrial Internet of Things)
The Customizable Modular PC
Flexible and Expandable modular PC
Tensor-I22 is a build-to-order modular PC from Compulab. It provides a high level of customization and expandability for various use cases. The PC can be configured with a choice of CPU, memory, storage, and pre-installed operating system. Tensor-I22 can be extended with TEL (TEnsor ELlement) modules, which are extension cards that offer additional functionality and I/O. There are different types of TEL modules available, including Input/Output TELs, USB TELs, Networking TELs, Storage TELs, Extension TELs, and Power Modules.
Use Cases Examples
Industrial Automation
The Tensor-I22 can be used in industrial automation with the TEL-CANBUS module, which supports CAN 2.0A specifications and ISO 11898-2. The TEL-SERX4 module can also be added for RS232/RS485 communication.
Traffic Control and Surveillance
The Tensor-I22 can power traffic control and camera operations with the TEL-POEX2 module, which adds gigabit Ethernet connectivity, and the TEL-DCIN module, which provides DC input for external power supply. This setup ensures reliable and efficient power for your critical surveillance and traffic management needs.
IoT Edge Computing
The Tensor-I22 can be used for IoT edge computing with the TEL-M2E module, which adds Wi-Fi connectivity, and the TEL-MINIPCIE module, which adds a mini PCIe socket with a SIM card tray and cellular connectivity.
Storage Solutions
The Tensor-I22 can be used as a storage solution with TEL-SATA1, which adds 2x 2.5″ SSD/HDD, and TEL-M.2 Key-M for NVMe, SATA, or AI modules, which add M.2 storage options.
Tensor-I22 Specifications
Base Configuration
CPU
Intel® Core i7-1185G7E
4 Core | Base: 1.8/2.8 GHz, Boost: 4.4 GHz | TDP: 15/28 3 W | vPro
Intel® Core i5-1145G7E
4 Core | Base: 1.5/2.6 GHz, Boost: 4.1 GHz | TDP: 15/28 3 W | vPro
Intel® Celeron 6305E
2 Core | Base: 1.8 GHz | TDP: 15 W
Chipset
Intel® 11th Gen. Core processor
RAM
Up to 64 GB
2x SO-DIMM DDR4 up to 3200MT/s
Graphics & Display
Integrated Intel® Iris® Xe Graphics
2x HDMI 1.4b (up to 3840 x 2160 @ 30Hz)
2x DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode
Native Interfaces
2x Gigabit Ethernet on RJ45 (Up to 4 ports)
4x USB Type-A: 2x USB 3.1 + 2x USB 2.0 (Up to 12 ports)
NVMe or SATA on M.2 (PCIe x4 Gen. 4 or SATA 3)
Up to 3 NVMe/ SATA storage devices
Notes:
- SATA ports are multiplexed with PCIe
- Some USB 3.1 ports are multiplexed with PCIe
- USB 3.1 gen 2 functionality depends on compatible TELs. Some TELs support only USB 3.1 gen 1
Functional Features
Serial/GPIO
Optional Serial/GPIO ports 1
Up to 20 RS-232 / RS-485 or 40+ isolated GPIOs
Optional RS-232 / RS-485 1
Up to 20 RS-232 / RS-485 ports on DB9
Optional CAN bus
Up to 5 isolated CAN bus ports on DB9
Optional GPIO
Up to 5 modules with 20 isolated GPIOs each, on terminal blocks
BIOS & OS
Internal firmware TPM
Discreet TPM
Intel® PTT (TPM 2.0)
Optional discreet TPM 2.0: RSA-2048, ECC-256, SHA-256, EAL4+
OS Support
Windows 10 – Windows 10 IoT Enterprise LTSC 2021 / Windows 10 Pro
Windows 11 – Windows 11 Pro
Linux – Linux Mint / Ubuntu
Auto-on
On power resume, system powers on and boots.
Tensor elements (TELs)
Optional TEL expansion modules
Name
Description
Max Units
PN
TEL-NVME
Additional M.2 Key-M for NVMe 1
1
FFN
TEL-M2NVME for SATA
Additional M.2 Key-M for SATA 1
1
FFS
TEL-NVME for AI
Additional M.2 Key-M for AI module3
1
FFA
TEL-SATA1
SATA for 2.5″ SSD / HDD
1
FT
Power Modules
Name
Description
Max Units
PN
TEL-P12
Standard power module for 12VDC PSU with twist lock, Incl. 60W PSU and AC cord.
1
As standard with PSU
PN w/o PSU
TEL-P56
Wide power module for 12V – 56V DC, ATX connector with locking, Incl. 120W PSU and AC cord.
1
P56 with PSU
P56N w/o PSU
Input/Output TELs
Name
Description
Max Units
PN
TEL-SERIALx4
4x RS232 / RS485 with DB9 connectors
1
FH
TEL-SERIALx1
1x RS232 by DB9
1
FHA
TEL-CANBUS
Using DB9 connector, supports CAN 2.0A Specifications and ISO 11898-2
1
FQ
TEL-GPIO
GPIO – terminal block of 4x GPIO + 4 headers of 4 GPIO each
20
FS
TEL-GPIOEXT
GPIO by a terminal block to be used with TEL-GPIO
4
FV
TEL-AUDIO
Headphones / line-out + microphone using 2x 3.5mm
1
A
USB
Name
Description
Max Units
Stacking
TEL-USB3X4V
USB3.1 type A
4
FEA
TEL-USB2X4V
USB2.0 type A
4
FEC
Networking
Name
Description
Max Units
PN
TEL-LANx2
2x Gbit Ethernet ports using RJ45
8
FC
TEL-POEx2
2x Gbit Ethernet with PoE PSE 802.3at Type 1 by RJ45
8
FU
TEL-OPLN2
2 x SFP+ socket for optical GbE connection
2
FW
Dimensions
Dimensions & Weight
Dimensions
From: 20 cm (W) x 20 cm (D) x 2.5 cm (H) – 1.0 liter
To: 30 cm (W) x 20 cm (D) x 6.9 cm (H) – 4.1 liter
Weight
From: 1 Kg to 4 Kg
- Dimensions depend on enclosure variant
- Weight depends on enclosure variant and on configuration
Housing & Cooling
All aluminum housing
Fanless cooling
- Dimensions depend on enclosure variant
- Weight depends on enclosure variant and on configuration
Mounting
VESA mounting bracket*
Wall mounting bracket*
DIN-rail mounting bracket*
* Sold separately
Operating Conditions
Power
Input voltage range
12V – 56V*
Power consumption
20W – 40W
Power consumption depends on
– CPU type and TDP settings
– System load
– Installed devices
– Connected peripherals
* Input voltage range depends on the power module used.
Operating Environment
Commercial temperature
Extended temperature
Industrial temperature
Humidity
0°C to 45°C
-20°C to 70°C, sample testing
-40°C to 70°C, full testing
5% – 95% non-condensing
