MCM-iMX93: i.MX93 SMD

Smallest foot-print and lowest cost

HIGH PERFORMANCE GRAPHICS AND IMAGE PROCESSING

Ideal for Space Constrained and Portable Systems

The i.MX93 family of processors features advanced implementation of a dual ARM® Cortex®-A55 core, which operates at speeds of up to 1.7 GHz. A general purpose Cortex®-M4 core processor enables low-power processing.

Up to 2GB LPDDR4 and 64GB eMMC

Top Features

CPU Core

CPUNXP i.MX9352, dual-core ARM Cortex-A55, 1.7GHz
NXP i.MX9331, single-core ARM Cortex-A55, 1.7GHz
NPUAI/ML Neural Processing Unit
Arm® Ethos™ U-65 microNPU
Real-Time
Co-processor
ARM Cortex-M33, 250Mhz

I/O

USB2x USB2.0 dual-role ports
UARTUp to 8x UART
CAN busUp-to 2x CAN-FD
SD/SDIO2x SD/SDIO
SPIUp to 8x SPI
I2CUp to 6x I2C
I3C1x I3C
ADC4x general-purpose ADC channels
PWMUp to 6x general purpose PWM signals
GPIOUp to 80x GPIO

Environmental and Reliability

MTTF> 200,000 hours
Operation temperature (case)Commercial: 0° to 70° C
Extended: -20° to 70° C
Industrial: -40° to 85° C
Storage temperature-40° to 85° C
Relative humidity10% to 90% (operation)
05% to 95% (storage)
Shock50G / 20 ms
Vibration20G / 0 – 600 Hz

Feature Highlights

  • Solderable as a regular QFN component
  • Designed for SMT assembly and reflow soldering
  • Tiny footprint and weight – 30 x 30 x 3 mm, 5 gram
  • Industrial temperature range of -40C to 85C
  • Availability guaranteed until 2038

Ultra Miniature Form-Factor

  • Dual-core ARM Cortex-A55 CPU, 1.7GHz
  • Up to 2GB LPDDR4 and 64GB eMMC
  • LVDS, MIPI-DSI and parallel RGB
  • 2x RGMII, 2x USB, 2x CAN-FD, 8x UART
  • 2x SDIO, 8x SPI, 6x I2C, 80x GPIO