Tensor I20A

IIOT (Industrial Internet of Things)

A WIDE VARIETY OF MODULES

Providing interface and support features

Tensor computer consists of motherboard, enclosure and wide variety of modules providing interface and support features.

Many different types of interface modules are available. User can select the required modules and this way to configure Tensor computer to match his specific needs.

Spec Sheet
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Tensor PC

Use Cases Examples

Lab Sensors Processor

Tensor configured with 12 USB ports connected to digital pressure transducers, thermometers, and other sensors. Acquired data is processed by powerful Xeon CPU, relevant results are stored in built-in 2TB NVME and transferred to cloud through 1Gb LAN. Second LAN port and LTE modem is used for remote access and management.

Special Purpose Router | Firewall

Special secure router for 16 LAN ports, including run-time content monitoring, as required by financial institution.

Factory Automation PC

Assembly line controller installed on manufacturing floor. Including variety of interfaces for machine connection – isolated CanBus ports, dry contact relays on terminal blocks, USB ports, support for 3 display screens, LAN port, power supply entries with failsafe redundancy.

Tensor I20A

Figures

Base Configuration

CPU

Intel Xeon E-2276ML

6 Cores, 12 Threads, 12 MB cache, ECC support

Intel Core i7-9850HL

6 Cores, 12 Threads, 9 MB cache

Intel Core i5-9300H

4 Cores, 8 Threads, 8 MB cache

Intel Core i3-9100HL

4 Cores, 4 Threads, 6 MB cache, ECC support

Intel Celeron C4930E

2 Cores, 2 Threads, 2 MB cache, ECC support

Chipset

Intel CM246 Chipset

RAM

Up to 64 GB DDR4-2400 ECC | non-ECC

2x SODIMM DDR4-2400 ECC | Non-ECC (unbuffered)

Graphics & Display

Integrated Intel UHD Graphics P630 / 630 / 610

Up to 3x DisplayPort 1.2 – 4K @ 60 Hz | HDMI 1.4 – 4K @ 30 Hz

Specific types of ports depends on selected TELs.

Native I/O Buses and Interfaces

Up to 38 PCIe 3.0 lanes (25 ports)
Up to 5x USB 3.1 gen 2
Up to 8x SATA 3

Notes:

  • SATA ports are multiplexed with PCIe
  • Some USB 3.1 ports are multiplexed with PCIe
  • USB 3.1 gen 2 functionality depends on compatible TELs. Some TELs support only USB 3.1 gen 1

Functional Features

Storage Features

NVMe M.2 2280

Up to 8 NVMe devices can be installed, each with PCIe 3 x4 interface

SATA M.2

Up to 2 SATA devices can be installed, (M.2 key-M 2280 | 2260 | 2242)

mSATA

Up to 2 mSATA devices can be installed

SATA 2.5"

— Under development —

I/O Features

Display

Up to 3x 4K displays
– DisplayPort 1.2 4096×2304 @ 60Hz
– HDMI 1.4 4096×2160 @ 30Hz

USB

Up to 4x USB 3.1 gen 1
Over 40 ports of USB 2 can be installed
USB power in S5 can be configured per port

Audio

3.5mm jacks.
Headphones out + mic. in using TI PCM2912A Codec.
Multiple audio ports can be installed.

Serial Ports

Using DB9 connector.
Each port supports RS232, RS485 half/full duplex and can be configured independently.
Over 20 ports can be installed.

CANbus

Using DB9 connector
Supports CAN 2.0A Specifications and ISO 11898-2
Bit rate of up to 1Mbit/s
DIP switch for enabling/disabling on-board 120 Ohm termination
Isolation per UL 1577, transient immunity: 30kV/uS, isolated DC 5V power
CANbus is driven by a dedicated 32bit microcontroller (ARM Cortex M0 – STM32F042C6) running open source firmware that can be upgraded
Driverless operation in Windows
USB native device in Linux
Over 10 ports can be installed

GPIOs

Unidirectional Isolation block, isolation per UL 1577
GPIOs are driven by a dedicated 32bit microcontroller (ARM Cortex M0 – STM32F072CB) running open source firmware that can be upgraded
Each GPIO can be configured as input/output in software
Terminal block connector
3.3V / 5V level can be selected by a DIP switch
Over 100 GPIO ports can be installed

Networking Features

Gbit Ethernet

Using Intel i210, each port is on an independent PCIe port.
Using RJ45 ports.
20 ports can be installed.

Gbit Ethernet with PoE source (PSE)

POE+ 802.3at 30W per port.
Using Intel i210, each port is on an independent PCIe port.
Using RJ45 ports.
12 ports can be installed

LTE

Universal LTE cat 12 (SIMCOM SIM7912G-M2) by default.
Other M.2 key-B or mini-PCIe modems can be installed.
Each modem-TEL has a SIM card tray optionally accessible from the outside.
Number of antennas as required by modems can be installed. Antennas can be positioned anywhere on the computer’s perimeter.
Up to 9 LTE modems can be installed.

Wi-Fi

Wi-Fi 6 (Intel AX200) by default.
Buyer can install another Wi-Fi adapter.
Number of Wi-Fi antennas as required by Wi-Fi module. Antennas can be positioned anywhere on the computer’s perimeter.
Up to 9 Wi-Fi adapters can be installed.

Bluetooth

Bluetooth 5.1 (Intel AX200) by default.
Bluetooth is normally an added feature in a Wi-Fi adapter. Buyer can install another adapter.
Up to 9 adapters can be installed.

Extension Features

M.2 key E

Up to 9 M.2 key-E devices can be installed

M.2 key B

Up to 9 M.2 key-B devices can be installed.
Each has a SIM card tray optionally accessible from the outside.

M.2 key M

M.2 key-M devices up to M.2 2280 devices, PCIe x4
Each device has Integrated cooling
Up to 8 M.2 key-M devices can be installed

Mini PCI Express

Up to 9 mini PCI express devices can be installed. Each has a SIM card tray optionally accessible from the outside.

PCI Express

— under development —

Security, Reliability & Manageability Features

BIOS AMI Aptio V

Infineon SLM 9670AQ2.0

Features: TPM 2.0, RSA-2048, ECC-256, SHA-256, EAL4+

Operating systems:
Windows 10 Professional | Linux Mint

Compatible with other Windows 10 variants.

Compatible with other Linux variants.

Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)

Configuration control and reporting

In BIOS, TRIPs and connected TELs can be listed
For each TEL, revision, serial number and specific information (e.g. MAC address) can be displayed
TEL connected to each TRIP can be enabled on detection, disabled, or unconditionally enabled

Configurable CPU TDP

Maximum power of the CPU can be adjusted in BIOS to match:

  • Environmental conditions
  • Cooling capacity of the enclosure
  • Target operating temperature
Optional out-of-band management

Optional supervisor micro-controller featuring

  • Safe remote-BIOS-update
  • Powering up / powering down the system
  • Advanced watchdog
  • System recovery
Auto-on

On power resume, system powers on and boots.

BIOS & OS

Optional Trusted Platform Module 2.0 (TPM 2.0)

Infineon SLM 9670AQ2.0

Features: TPM 2.0, RSA-2048, ECC-256, SHA-256, EAL4+

Auto-detection of connected TELs and auto re-configuration
  • TELs are identified during power-up
  • TRIP mode is adjusted to comply with specific TEL requirements (e.g. 4x PCIe x1 / 1x PCIe x4 / SATA / USB3)
  • If TEL is incompatible to TRIP capabilities, TEL is automatically disabled
Configuration control and reporting

In BIOS, TRIPs and connected TELs can be listed
For each TEL, revision, serial number and specific information (e.g. MAC address) can be displayed
TEL connected to each TRIP can be enabled on detection, disabled, or unconditionally enabled

Configurable CPU TDP

Maximum power of the CPU can be adjusted in BIOS to match:

  • Environmental conditions
  • Cooling capacity of the enclosure
  • Target operating temperature
Optional out-of-band management

Optional supervisor micro-controller featuring

  • Safe remote-BIOS-update
  • Powering up / powering down the system
  • Advanced watchdog
  • System recovery
Auto-on

On power resume, system powers on and boots.

Tensor elements (TELs)

Storage TELs

Name
Description
Max Units
Stacking

TEL-NVME

M.2 2280 NVMe card or M.2 SATA

8

A,C

Tensor I20A

TEL-MSATA

mSATA card

2

A,C

TEL-SATAX1

1x 2.5″ SSD / HDD

8

A,C

Power Modules

Name
Description
Max Units
Stacking

PM-12V

A miniature 12V power module with polarity, overvoltage protection and twist-lock jack

2

A,C

Tensor I20A

PM-WIDE

A regulating wide-input voltage, high current power

2

C

PM-BALANCER

1x 2.5″ SSD / HDD

8

A,C

I/O TELs

Display TELs

Name
Description
Max Units
Stacking

TEL-HDMIMINIDP

HDMI + mini Display Port, designed for TRIP-M

1

A,C

TEL-DPHDMI

Display Port + HDMI, designed for TRIP-M

1

A,C

TEL-STD

Display Port + Gbit Ethernet on a single compact TEL, designed for TRIP-S

1

A,C

USB TELs

Name
Description
Max Units
Stacking

TEL-USB3X4V

4x USB3 type A vertical connectors, designed for TRIP-U

1

A,C

TEL-USB3X4V

4x USB3 type A vertical connectors, designed for TRIP-U

12

A,C

Other I/O TELs

Name
Description
Max Units
Stacking

TEL-USB3X4V

4x USB3 type A vertical connectors, designed for TRIP-U

12

A,C

Networking TELs

Name
Description
Max Units
Stacking

TEL-LANX2

2x Gbit Ethernet ports using RJ45 connectors

6

A,C

TEL-LANX4

4x Gbit Ethernet ports using RJ45 connectors

5

A, C

TEL-POEX2

2x Gbit Ethernet with PSE PoE (POE+ 802.3at, 30W per port) using RJ45 connectors

6

C, A (W30)

TEL-OPLNX2

2x fiber optics Gbit Ethernet using SFP+ sockets

6

C, A (W30)

Extension TELs

Name
Description
Max Units
Stacking

TEL-M2E

M.2 key-E socket

9

A,C

TEL-M2B

M.2 key-B socket with a panel mounted tray for SIM card

9

A, C

MINIPCIE

mini-PCIe socket with a panel mounted tray for SIM card

9

A, C

Enclosure Variants

Enclosure Variants

Tensor-PC I20A is offered in 18 different enclosure variants –

  • 2 widths
  • 3 compartment heights
  • 3 types of cooling ribs
Width
  • 20 cm (option W20)
  • 30 cm (option W30)
Compartment Height
  • 2.5 cm – stacking A (option H25A)
  • 3.5 cm – stacking C (option H35C)
  • 4.9 cm – stacking A+C (option H49AC)
Cooling Ribs
  • Flat with no ribs (option C0)
  • 1 cm ribs (option CR10)
  • 2 cm ribs (option CR20)

Dimensions & Weight

Dimensions

From: 20 cm (W) x 20 cm (D) x 2.5 cm (H) – 1.0 liter
To: 30 cm (W) x 20 cm (D) x 6.9 cm (H) – 4.1 liter

Weight

From: 1 Kg to 4 Kg

  • Dimensions depend on enclosure variant
  • Weight depends on enclosure variant and on configuration

Housing & Cooling

All aluminum housing

Fanless cooling

  • Dimensions depend on enclosure variant
  • Weight depends on enclosure variant and on configuration

Mounting

VESA mounting bracket*

Wall mounting bracket*

DIN-rail mounting bracket*

* Sold separately

Operating Conditions

Power

Input voltage range
12V – 56V*

Power consumption
20W – 40W

Power consumption depends on
– CPU type and TDP settings
– System load
– Installed devices
– Connected peripherals

* Input voltage range depends on the power module used.

Temperature & Humidity

Operating temperature range
Up to -40°C to 70°C*

Relative humidity
5% – 95% non-condensing

* When ordered in industrial temperature range. Commercial and extended temperature range are also available.